PVD (Physical Vapour Deposition) in ISO Class 5 Cleanroom

Physical deposition of metals onto wafer surfaces by melting or evaporating the metals using an electron beam. Wafer sizes up to 200 mm; 4 crucibles for multi-layer stacking processes; various adaptors for area-selective coating; available processes: Au, Ag, Cr, Ti, Ni, Pt, Pd, TiO₂, Cu, Ir. Vapour deposition sequences involving up to 4 materials are possible Share on