Horizontal Furnace / LPCVD System in ISO Class 5 Cleanroom

Deposition or growth of layers on wafers and diffusion of doping substances. Processes: Dry oxidation, wet oxidation with H₂/O₂ burner and deionized water evaporator, LPCVD poly-Si and silicon nitride, forming gas annealing of wafer sizes up to 200 mm; POCl₃ diffusion Share on